Our clients come to APS for our scientific expertise when the endeavor is enhancing an existing product, improving manufacturing efficiencies, or discovering a solution that creates an innovative new product.
APS chemists have extensive experience in bonding the same or different substrates together. Materials that are difficult to adhere to
are effectively bonded with APS' process. Again,no or minimal surface chemical attachment of one substrate to the other.
Consequently, substrate failure will occur before adhesion failure. In addition, if two substrates with different coefficients of thermal expansion are bonded, an APS developed adhesive's bonding action will not be affected. Such is not the case with conventional adhesives which cannot withstand the varying expansion and contraction of different substrates
Sometimes two or more layers of various materials are laminated together to achieve desired characteristics. A generic adhesive used
for all purpose applications may fail especially when temperature changes occur. Again, these conventional adhesives hold their substrates together by mechanical means. In addition, failure of the bond will occur during temperature fluctuations due to differences in coefficients of thermal expansion. The adhesives developed by APS use Bifunctional monomers and attach themselves to the substrates by a helical bond. This helix allows the resultant bond to move with the differences in the expansion and contraction rates of the substrates. Even substrates that are typically difficult to bond are activated and attached by this means.