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Chemical Grafting

APS unique chemical grafting process results in properties being permanently attached to the substrate with the use of a specialized substrate activator and monomer system. The following are the most commonly used substrates and desired properties for use with APS process application methods.  . 

Most Common Application Methods

This is only a reference list of the application methods and does not represent the full process capabilities which can be applied


Most APS coatings can be applied in one step with no or minimal surface preparation. In addition, due to the chemistry of APS chemical grafting process, thinner coatings can be used to achieve a higher degree of property performance.

Delamination will not occur due to the chemical bond formed between the coating and the substrate with some subsurface penetration occurring through the use of molecularly small and lightweight monomers.Typical coating methods can be used such as dip, spray, roll, flow coat, etc.


APS coatings can be formulated to be air dried, however, in the interest of time, heat or some energy source (i.e., UV or infrared lights) can be used.


APS can develop additives to incorporate into the  raw material / resin prior to extruding or molding. In this case, the new properties will penetrate the matrix of the material.


APS chemists will adjust the formulation to conform to the processing parameters used by the manufacturer.


Due to the molecular bond formed by the APS process the new properties will not migrate and leach from the material over time, even under severe conditions.


APS chemists have extensive experience in bonding the same or different substrates together. Materials that are difficult to adhere to are effectively bonded with APS process. There is no or minimal surface chemical attachment of one substrate to the other. Consequently, substrate failure will occur before adhesion failure.


In addition, if two substrates with different coefficients of thermal expansion are bonded, an APS developed adhesive's bonding action will not be affected.


This is not the case with conventional adhesives which cannot withstand

the varying expansion and contraction of different substrates.


Application of all APS chemical grafting

formulations can be applied at ambient temperatures and normal atmospheric conditions. Typically an add-on of approximately 1-5% is used. 

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